QCOM和其他常見芯片平臺術語縮寫（持續更新中）

1 QCOM
ACB：Ali Cloud Bridge
ALSA DCP：ALSA由DAI、Codec、Platform三部分組成
ALSA TLV：Type-Length-Value
Alternative Mode: 替代模式
ANC：Automatic Noise Canceller
APQ: Application Processor Qualcomm
ASM: Anntena Switch Module
AT：ATtention Command
ATCoP：AT Command Processor
BenQ：Bring Enjoyment and Quality Life，享受快樂科技
bootloader DA：Download Agent，MSM的firehose就是DA，而PBL也叫做bootROM
CAT M1: Category Minus 1
CCC：Common Command Codes，for I3C（Android 9.0 ADSP支持，類似於USB HSIC）
CCGP：Windows USB Common Class Generic Parent，Linux內核類似的驅動就是usb_generic_driver
CDP: Core Development Platform
CDT：Configuration Data Table
CNN：Android中的ConnectivityService、NetworkPolicyManagerService、NetworkStatsService（數據統計）、NetworkManagementService（最底層，物理網絡接口的管理服務，與netd通信）
C-sharp：音樂裏C升調，或者C#語言
config_tether_upstream_types：Android手機配置爲ApCli（AP-Client）時，作爲Client的一方
config_tether_usb_regexs：regular expressions，正則表達式
CSP: Continue on Short Packet , DWC3
CV: Customer Visit
DRI: Directly Responsible Individual，SSC Data Ready Interrupt
DS：USB Data Service
DSDA：Dual SIM Dual Active
DSDS：Dual SIM Dual Standby
DSR: Deferred Service Routine
EDL: Emergency Download
FFA: Form Factor Accurate
FFBM: Fast Factory Boot Mode
FLCB: Fast Low Current Boot
FLP：Fused Location Provider
FSG: A Golden File System
GDHS: Globally Distributed Head Switch(L2 cache)
GLink：General Link，代替SMD的新機制
Gobi：Global Mobile Internet Technology，全球移動互聯網技術，如MDM9x15等系列
GRL：Granite River Labs ，美國工程測試認證實驗室
haptics: 觸覺反饋
HDET: High Power Detector
HIDL：HAL Interface Definition Language，讀作hide-l；/dev/vndbinder - vendor binder
HKADC: Housekeeping ADC, 交互管理ADC
HMD：The Home Of Nokia Phones
HVDCP3: DPF_DMF values for Floating（non-drive mode）and DPR_DMR values for Removing the float of DP/DM lines.
HVDCP-OPTI：High Voltage Dedicated Charging Port-OPTImization（QC3.0 and QC4.0 PPS）
IAAD: EHCI Interrupt on Async Advance Doorbell
IOA: Interrupt on ACK, USB
IOC: Interrupt on Completion（DWC3）；Interrupt On Change（for PIC MCU）
IOT: Interrupt on Token, USB
IPO: Instant Power On
ISP:  Image Signal Processor
ISP: Interrupt-on Short Packet, DWC3
Jungo USB：Jungo公司的USB設備和主機協議棧，for MDM9200
KBA: Knowledge Base Article
LDPC：Low Density Parity Check，for 5G
lwip：Light Weight Internet Protocol
MBHC：MultiButton Headset Control
mbn: Modem Configuration binary
MDM: Mobile Data Modem
MLME：Mac Layer Management Entity
modemst: modem efs partition
MPQ: Media Processor Qualcomm
MSM: Mobile Station Modem
MTC: Machine Type Communications
MTP: Modem Test Platform
nl80211：使用netlink配置WiFi，代碼層次關係從上到下分別是nl80211-cfg80211-mac80211（包含ieee80211_ops），縮寫爲NCM；而wext基於ioctl方式配置WiFi
NV：Nonvolatile Data
PBL：Primary BootLoader
PBM: Phonebook Manager
PC: Parallel Charger (並聯充電模組)
PDU：Protocol Data Unit
PMxxxx: xxxx PMIC Core
PMIxxxx: xxxx PMIC Interface
PMIC BCD：Bipolar CMOS DMOS
PPID：Parent Process ID（Linux ps命令可以看到）；MFi Product Plan ID，例如 = 147312-0020，106455-0155
QCA: Qualcomm Atheros
QCCI：QMI Common Client Interface
QCMAP: Qualcomm Mobile Access Point Service
QCSI：QMI Common Service Interface
QDSP：Qualcomm Digital Signal Processor
QFE: Qualcomm Front-end
QHEE：QCOM Hypervisor Execution Environment
QMI：Qualcomm MSM Interface
QMI_PDS：QMI Position Determination Service - for GPS
QPNP: Qualcomm Plug and Play
QSC: Qualcomm Single Chip
QSD: Qualcomm Snapdragon
RBCO：Rock Bottom Current Optimization，底電流調試
RDM：Runtime Device Mapper
REX：Real-time Executive OS
RMA: Return Material Authorization
RFFE: Radio Frequency Front-end
RTR: Radio Transceiver
SBL：Secondary BootLoader
SBZ：Should Be Zero
SCHG: Switching charger
SDU：Sensor Data Unit
SIO：Serial Input and Output，對各種串行接口數據的預處理（SDIO/UART/USB）
SMD：Shared Memory Device
SNOC：System Network On Chip
Socket BLA：bind()、listen()、accept()
SRLTE: Simultaneous Radio and LTE
SSC：Snapdragon Sensors Core
SSR：SubSystem Restart
SSUSB-QMP：QCOM Multiple Protocol Phy
SURF: Subscriber Unit Reference Platform
TCSR: Top Control and Status Register
TDI：TransDimension Inc.
TE：Terminal Equipment
ThreadX: X means context switching
Tilt Sensor：擡手亮屏傳感器，另外一個Wrist Sensor（檢測翻腕動作），與Tilt差不多
ttyAMA：AMBA
ttyHSL：tty High Speed Serial Lite
ttyOx：tty OMAP
ttySAC：tty Special Administrator Control
UniPro: Universal Protocol
USAM：Universal SSC Algorithm Module，ADSP SSC算法模塊
vivo NEX：其命名來源於英文單詞“NEXT”的縮寫
WCD: wafer codec/decode
WCN: wireless connectivity network
WTR: Wafer Transceiver
XBL：Extended BootLoader
XPU: Embedded Memory Protected Unit

SDA：Snapdragon Auto（汽車APQ）
SDAm：汽車MSM
Snapdragon Mobile (SDM) = MSM
Snapdragon Modem（SDX）= MDM
Snapdragon Mobile (Compute) (SDA) = APQ
Snapdragon Mobile (Compute) (SDC) = MSM
SDW：Snapdragon Wear
SDW1100 = MDM9207-1
SDW1200 = 取MDM9206的Modem和Snapdragon Wear 1100/2100的AP
SDW2100 = MSM8909w

Linux發行版軟件升級工具縮寫：
CentOS yum：[jʌm]，Yellowdog Updater，Modified
Ubuntu apt-get：Advanced Packaging Tool

LSM（Linux Security Module）的五種實現：
SELinux：Security Enhanced Linux，基於inode，Android當前使用的就是這種
SMACK：Simple Mandatory Access Control Kernel，基於inode
Tomoyo：日本女人名“智代”，日本人實現的代碼，基於path
AppArmor：應用盔甲，AppArmor is installed by default in Ubuntu
Yama：來自梵文，中文名爲“閻羅”，只處理ptrace和文件鏈接

MSM軟件成熟度：
FC：Feature Completed
ES：Engineering Sample
CS：Commercial Sample

Platforms：
ADP：Automotive Development Platform
CDP：Core Development Platform
FFA: Form Factor Accurate
FLUID：Forward Looking User Interface Device
LiQUID：Large Qualcomm User Interface Device
MTP：Modem Test Platform
QRD SKU：Qualcomm Reference Design Skull
SURF: Subscriber Unit Reference Platform

2 QMI
QMI - QUALCOMM
https://wenku.baidu.com/view/746edafa84868762caaed58f.html

基於MDM9200平臺的無線數據卡自啓動子系統的設計和實現.pdf
https://www.taodocs.com/p-34389395.html

3 ARC
ARC：Synopsys Argonaut RISC Core
ARC EM5D：Synopsys ARC Embedded 5 DSP
ARC EM SEP：Synopsys ARC Embedded Safety-Enhanced Processor
ARC HS：Synopsys ARC High-Speed

4 Charge
4.1 Misc
OPPO VOOC：Voltage Open-Looped, Multi-Step Constant-Current Charging，電壓開環，多步恆流充電

4.2 MTK Charge
BATSNS：充電電流檢測電阻的負極
BAT：電池正極引腳
BAT_ON：電池NTC (熱敏電阻) 引腳
CAR：庫侖計
Cmax/Qmax：電池容量
DOD：Depth of Discharging，放電深度百分比
ept：MTK Easy PinMux Tool
ISENSE：充電電流檢測電阻的正極
mAh：放電容量
OCV：Open Circuit Voltage，開路電壓
RECHARGING_VOLTAGE: 回充電壓
R (battery)：電池內阻，(V2-V1)/400mA
SOP: Standard Operation Procedure，操作指導
VC (=VBAT)：Voltage of Closed Circuit，閉路電壓，Charge ADC採樣的到電壓就是閉路電壓
VCHG：USB正極
VCDT：VCHG Charger Detect充電電壓檢測腳
ZCV：（Zero Current） Voltage，零電流-電壓，一般指ZCV的2個表格（開路電壓-放電深度百分比，開路電壓-電池內阻）

5 Display and Camera
3A：自動對焦（AF）、自動曝光（AE）、自動白平衡（AWB）
CSI：Camera Serial Interface
DSI：Display Serial Interface
EOS：Electro Optical System，佳能電子光學系統
EVS：Exterior View System，Android車載系統Camera架構HAL層（不同於手機Camera架構）
FPC指紋：FingerPrint Cards AB
FPD：Flat Plane Display
GMSL：Gigabit Multimedia Serial Link
HPD：HotPlug Detection
NTxxxx屏幕：聯詠科技novatek
TNT顯示器：Touch & Talk

ADAS攝像頭種類：
ADAS：Advanced Driver Assistance System，先進駕駛輔助系統，Bosch提供整個方案模塊
ADASIS：Advanced Driver Assistant Systems Interface Specifications，EHP規範
AVM：Around View Monior，360°環視攝像頭
DMS：Driver Monitoring System，疲勞駕駛監控，使用GHS INTEGRITY RTOS系統，通過車載以太網通信（PHY工作在Master模式，連接時，會主動和Slave PHY進行鏈路訓練），法國Valeo提供方案
DVR：Digital Video Recorder，行車記錄儀
RVC：Rear View Camera，倒車影像
SVC：Side View Camera，盲區攝像頭

6 DSP
CEVA公司：塞瓦定理，是由意大利幾何學家Giovanni Ceva發現，用來證明共點線的一個幾何原理，通常稱爲彙集定理。當今將各種技術彙集在單個產品之上正是半導體工業大勢所趨，以塞瓦定理命名的CEVA公司也正是秉承這一理念才走到了今天。

7 GPS
C/A碼：Coarse / Acquisition Code，粗碼
CNR：Carrier Noise Ratio
EPO: Extended Prediction Orbit
GGA: Global Positioning System Fix Data，定位信息
GLL: Geographic Position, Latitude/Longitude，地位地理信息
GNRMC：Global Navigation Recommended Minimum sentence C，多模推薦定位信息
GPRMC：GPS Recommended Minimum sentence C，GPS推薦定位信息
GSA: GPS DOP and Active Satellites，當前衛星信息
GSV: GPS Satellites in View，可見衛星信息
NAV-DOP：Dilution of Precision，精度因子，U-BLOX的私有的UBX消息包
NAV-PVT：Position Velocity and Time（UTC），U-BLOX的私有的UBX消息包；fixType表示定位有沒有成功標誌字段，velN表示NED north velocity
P碼：Precise Code，精碼
QMI_PDS：QMI Position Determination Service - for GPS
RMC: Recommend Minimum Specific GPS/TRANSIT Data，推薦定位信息
RTCM：Radio Technical Commission for Maritime services，海事無線電技術委員會
VTG: Track Made Good and Ground Speed，地面速度信息
ZDA: Time & Date，時間日期信息

8 GPU
Adreno：名字改自於Radeon
Falcon：FAst Logic CONtroller。NVIDIA私有的RISC MCU，主要用在桌面GPU（Falcon中的寄存器一般映射到PCI BAR0）或者Tegra xHCI控制器中。NVIDIA正在把私有的Falcon MCU架構換成RISC-V
GeForce：Geometry Force，幾何威力
GTX顯卡：Grand Touring eXtreme
IMG AXT-64-2048：Imagination Technologies；A表示AI，A系列的意思；XT表示eXTreme
LE：Low Edition，低端版
Mali：Maliak，在克羅地亞語中的含義是small
RTX顯卡：Ray Tracing eXtreme
TI：Titanium 鈦
Voodoo：這個起源於南美古老而又神祕的宗教，巫毒教

9 MCU and SOC
ABOV：AP（Application Processor）Division of Magnachip Semiconductor，韓國現代單片機
AT91SAM9260：SAM means Smart ARM-based Microcontroller
ATMEL SAMBA：ATMEL Smart ARM-based Microcontroller Boot Assistant
CC2540：ChipCon
CHKS009：鑫匯科電磁爐MCU
ED：Engineering Debug
EFM32：Silicon Labs, Energy Friendly Microcontroller
ICC：Integrated Cockpit Controller
IOC：Input Output Controller，車機MCU
LPC：NXP, Low Power Consumption
Marvell SoC ARMADA：（西班牙的）無敵艦隊
MCS-51：Micro Computer System
Microchip PIC：Programmable Interface Controller
MSP：TI, Mixed Signal Processor
OTA：Running change
PSoC：發音p sock
PXA：Xscale Application Processor
RA：Renesas Advanced
RX：Renesas eXtreme
RH850：Renesas High-performance
RISC-V：讀作risk-five，表示爲第5代RISC
STC：SysTem Chip
Tegra K1：K means Kepler
Tegra X1：X means Maxwell，Drive CX（Cockpit Maxwell），Drive PX（Auto-Pilot Maxwell）
Workaround：確定現象，找不到root cause，但是可以解決；與rework的意思大概相同（可能印度人用的多）

10 Misc
CoAP：The Constrained Application Protocol
Coap就是把16進制的高4位和低4位分別轉化成字符進行傳輸。(Python：hexdigest)
例如要傳輸16進制的：0xAB
Coap傳輸：字符A 字符B ====》轉換成ASCII字符===》0x41 0x42都變成可見字符了

MFF：eSIM M2M form factors
RCA：Root Cause Analysis
RMA：Return Materials Authorization，芯片失效測試
一般是指公司內部的退貨流程，假設一公司售出某物品, 因爲品質問題或出錯貨，客戶要求退貨，公司經過與客戶溝通後，確認客戶可以退貨。
SOP：Standard Operation Procedure，操作指導
SOP：Start Of Production，開始量產

11 NXP/Freescale
74HC04D：High CMOS，最後一個D表示封裝形式
Access.bus：USB前身
HCS08：Freescale High-speed CMOS Speedup，簡寫爲S08
ISP1161：Philips' Integrated host Solution Pairs 1161，“Firms introduce USB host controllers”，https://www.eetimes.com/document.asp?doc_id=1290054
MC i.MX6Q：（Motorola Advanced Computer System on Silicon）innovative Multimedia eXtended 6 Quad Core；最早由SigmaTel創立
MQX RTOS：Message Queue eXecutive
PowerPC：Performance Optimization With Enhanced RISC – Performance Computing；the "PPC" prefix is IBM terminology；Motorola uses the mnemonic "MPC" instead
SBC：Single Board Computer
SJA1000：Stand-alone CAN controller，C51並行接口
TFA：Terminal For Amplifier
TJA1050：Transceiver，High-speed CAN transceiver
UJA1164：Mini high-speed CAN System Basis Chip（SBC）transceiver， SPI接口

12 Sensor
12.1 General
HRV：Heart Rate Variability（心率變異性），光電心率沒有辦法檢測HRV數據的，需要ECG纔可以測量；心率變異性(HRV)特指心跳時間間隔的微小變化。心率變異性變化越大，表明自主神經系統對身體協調作用越好、身體具備更多的活力。測量心率變異性(HRV)可以直觀反映一個人的身體健康狀況，並且也能夠判斷目前的訓練方式對改善身體狀態是否有效。
PDR：Pedestrian Dead Reckoning，室內定位(計算相對位置的定位方法)
PDR定位是一種基於傳感器信息計算相對位置的定位方法，首先通過加速度傳感器檢測行人的步數並計算出步長，然後通過磁阻傳感器和陀螺儀計算出行人的航向角，最後獲取人體移動的相對位置從而實現定位。相較於其他室內定位方法，PDR不受外界環境影響，定位精度較高，但只能獲取相對位置信息且存在累積誤差。
PPG：photoplethysmography，光電心率傳感器，Apple Watch用的就是這種

12.2 Sensors Part Number
12.2.1 Bosch
BHI160B：Bosch Sensor Hub with MEMS IMU 160B
BMA355：Bosch 3-Axis MEMS Accelerometer 355
BMI160：Bosch 6-Axis MEMS IMU 160

12.2.2 ST
AIS328DQ：Automotive Inertial Sensor - 3 axes - 2/4/8g full scale - Digital Output - QFPN package
A3G4250D：Automotive - 3 axes - Gyroscope - 4x4 LGA 16L - 245dps full scale - Digital Output

LIS3DH：Linear Inertial Sensor - Digital Output - High Level
LPS001DL：Linear Pressure Sensor - Digital Output - Low Level
LSM303DLH：Linear Sensor Module - Digital Output - High Level

13 TI
AM335x：ARM MPU，可以運行Linux的才叫MPU，否則叫MCU，用於工控
BQ：Benchmarq
CC2530：TI ChipCon2530
DRA746：DRAgon，Jacinto，名字來源於德州儀器汽車電子處理器美國辦公室旁邊的一條河
McBSP：Multichannel Buffered Serial Port
TDA：TI Driver Assistance
TLC：Texas Instruments Linear CMOS
TLV：TI Low Value，高性價比
TMS：Texas Manufactured Semiconductors
TMX：Texas Manufactured Experimental Device
TPS：TI Performance Solution

14 USB
ACP：iPod Authentication CoProcessor，IC mfi337s3959
iAP2：iPhone CarPlay iOS Accessory Protocol, Version 2，iAP2分爲3層，分別是傳輸層、鏈路層、會話層；而iAP1沒有分層的概念
ARC：Argonant RISC Core
ATS：Accessory Test System，iPhone Carplay自測試
CCG2：Type-C Controller Generation 2
CCG3PA：Type-C Controller Generation 3 Power Application
CCGP：Windows USB Common Class Generic Parent，Linux內核類似的驅動就是usb_generic_driver
CMG1：USB Type-C EMCA Controller Generation 1
dp：Dual Port，或者Display Port
DWC2/DWC3：Design Ware Controller，Apple的嵌入式設備，包括iPad和iPhone都是使用的DWC2
EZ-USB：Easy AnchorChips
FTDI：Future Technology Devices International
giveback：歸還 - ehci_urb_done() -> usb_hcd_giveback_urb()。USB PD中的giveback（= 1）指sink會響應source的GotoMin請求，返還部分電力給source。
HX3C：Cypress USB Type-C Hub with PD
IAAD：EHCI Interrupt on Async Advance Doorbell
IDT：Integrated Device Technology
iPhone XR：R means Regular
ISP1161：Philips' Integrated host Solution Pairs 1161，“Firms introduce USB host controllers”，https://www.eetimes.com/document.asp?doc_id=1290054
MDATA：More DATA，USB雙緩衝（ep_kind配置使能）切換機制對應到DATA0和DATA1
MTK BICR：Built-in CDROM
NEC uPA, uPB, uPC, uPD：uP：微型產品（micro Product），A代表Analog（混合元件），B代表bipolar（雙極數字電路），C代表雙極模擬電路，D代表單極型數字電路
PDI1394L40BE，PDIUSBD12：TODO
PTN5100：Part Number
Quirks：the attributes of a device that are considered to be noncompliant with expected operation
RNDIS OID：Object Identifier
RNDIS wceis：Windows CE Internet Sharging，（WceIsVista.INF -- This is the inf installation script for RNDIS-over-USB host driver for Intenet Sharing device.）
Renesas名字由來：Renaissance Semiconductor for Advanced Solutions
SL811HS：Cypress/ScanLogic 811 Host/Slave，性能上與ISP1161（Integrated host Solution Pairs 1161）相當
SSUSB-QMP：QCOM Multiple Protocol Phy
TDI：TransDimension Inc.，該公司首先發明瞭將TT集成到EHCI RootHub中的方法，這樣對於嵌入式系統來說，就省去了OHCI/UHCI的硬件，同時降低了成本，作爲對該公司的紀念，Linux內核定義了宏ehci_is_TDI(ehci)；產品UHC124表示USB Host Controller；收購了ARC USB技術；現已被chipidea收購，chipidea又被mips收購
TLV：TI Low Value，高性價比
TPS：TI Performance Solution
TT：Transaction Translator（事務轉換器，將USB2.0的包轉換成USB1.1的包）
µAB：Micro AB
USB BH reset：Bigger Hammer or Brad Hosler，表示warm reset；you may be confused why the USB 3.0 spec calls the same type of reset "warm reset" in some places and "BH reset" in other places. "BH" reset is supposed to stand for "Big Hammer" reset, but it also stands for "Brad Hosler". Brad died shortly after the USB 3.0 bus specification was started, and they decided to name the reset after him. The suggestion was made shortly before the spec was finalized, so the wording is a bit inconsistent.
USB3 BULK Stream ID：對應到SCSI Tag或者SATA Tag
USB KVM：KVM是鍵盤(Keyboard)、顯示器(Video)、鼠標(Mouse)的縮寫；KVM端口是25-pin，包含VGA接口和USB接口
uSOF：micro Start of Frame，125us
VIL：wValue，wIndex，wLength
WinPE：Windows Preinstallation Environment

IC Prefixes
http://dialelec.com/semiconductorprefixes.html

15 x86
查看進程ps -A
ABL：Automotive BootLoader，是UEFI的一部分，ABL負責啓動bootloader（= kernelflinger），kernelflinger啓動boot.img
Android LTS：Long Term Support
Android MR1：Maintenance Release
ELK：Emergency Linux Kernel
GR_MRB：Gordon Peak Modular Reference Board
HECI：Host Embedded Controller Interface，Host OS和x86 ME的通信接口，只有4pin，分別是REQ#、GNT#、TX和RX，目的是爲了代替SMBus
IFWI：Intel Proprietary Integrated Firmware Image
Intel BXT：Broxton
MEI：Intel Management Engine Interface；一個獨立的子系統，使用ARC處理器，OS是Minix 3，固件整合到BIOS中，通過PCI橋片在x86端訪問ARC的local端
MPH：USB Multi-Port Host，Intel的MPH的Port1作爲OTG使用，和DWC3（僅作爲slave）使用一個MUX開關來控制Host還是UDC連接到該Port1
SPH：USB Single-Port Host
TOS：Trusted OS，類似於ARM的TZ
vbmeta：Verified Boot Meta Image Partition