沉寂4年後，小米自研澎湃芯片終於歸來，但可能有些失望了

{"type":"doc","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"blockquote","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"雷軍表示，從澎湃芯片立項到2017年發佈澎湃S1，直到今天澎湃C1的發佈，小米的芯片之路走了7年。期間，小米歷經挫折和突破。"}]}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"小米正式發佈自研圖像處理芯片"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"沉寂許久的小米造芯計劃，終於有了新動靜。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"3月30日晚，在小米春季新品發佈會（第二場）現場，小米正式發佈了自研的圖像處理芯片— 澎湃C1。這是小米首款專業影像芯片。澎湃C1是一顆由小米自研的圖像信號芯片，作爲手機影像的“大腦”，它脫離SoC, 獨立在主板之上。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.infoq.cn\/resource\/image\/b1\/25\/b137cd88dc73c048c4f967453c3bdc25.jpeg","alt":null,"title":"","style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":"","fromPaste":false,"pastePass":false}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃C1芯片是小米自研ISP+自研算法的結果，澎湃 C1 採用更精細且更先進的3A處理。據小米官方介紹，這個3A指的是的AF對焦、AWB白平衡及AE自動曝光，擁有雙濾波器的澎湃C1可以實現高低頻信號並行處理，信號處理效率提升100%，3A表現大幅提升。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃C1是由小米研發，交予臺積電成片的一顆芯片。澎湃C1芯片具有高性能、低CPU和內存佔用特性，在3A算法、暗光對焦能力和畫質上進行提升，帶來更準確的自動白平衡、自動對焦、自動曝光和成像質量。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"bulletedlist","content":[{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"更好的自動對焦（AF），大幅提升暗光、小物體及平坦區域的對焦能力；"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"更精準的白平衡（AWB） ，複雜混合環境光也完全駕馭；"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"更準確的自動曝光（AE）策略。"}]}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"strong"}],"text":"該款芯片已經應用在此次小米發佈的新品手機 — 小米MIX FOLD上，預計後面還會有更多手機用上這款芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米MIX FOLD是小米首款摺疊屏手機其採用內折設計，擁有內外兩塊屏幕。核心硬件方面，小米MIX Fold搭載了高通驍龍888處理器，輔以LPDDR5+UFS 3.1的內存組合。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"strong"}],"text":"雷軍表示，小米2014年立項做澎湃芯片，2017年發佈澎湃S1，直到今天澎湃C1的發佈，小米的芯片之路走了7年。期間，小米歷經挫折和突破 ，澎湃C1只是小米芯片的一小步，同時也是小米影像技術的里程碑。芯片這條路很漫長，小米心懷敬畏，這條路充滿險阻，但小米會一直努力做下去。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.infoq.cn\/resource\/image\/1e\/cd\/1e9aee9a025e41925ec3c91f123b3acd.jpeg","alt":null,"title":"","style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":"","fromPaste":false,"pastePass":false}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"儘管這次新芯片是負責圖像處理的ISP，但研發難度也不低，小米介紹，這顆芯片是小米耗時2年投入1.4億研發費用打造的產品。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"小米的7年造芯夢"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米的造芯夢始於2014年。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"當年，小米成立了松果電子公司，負責芯片研發設計。“芯片是手機科技的制高點，小米要成爲偉大的公司，必須要掌握核心技術。”雷軍曾如是解釋，小米爲什麼要自研芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"爲實現這個目標，小米不惜大手筆投入。小米斥資1.03億從聯芯科技買下了SDR1860 平臺技術，並從各個芯片廠商開出高薪挖人組建起了芯片研發團隊。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米首款芯片產品是澎湃S1芯片，不同於小米產品“極致性價比”的基因，小米芯片一出手就定位中高端，雷軍曾表示， “如果把芯片分爲旗艦、高端、中端和入門級的話，我們的目標是對標高端”。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃S1芯片自2014年開始研發。2017年2月，小米澎湃S1芯片正式發佈，並搭載於小米5C手機上。澎湃S1芯片從立項到量產商用僅用了28個月的時間，要知道手機處理器的研發週期至少需要2年時間，例如，華爲的麒麟980，研發週期就長達3年時間。當時，澎湃S1如此短的研發週期頗令外界側目。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃S1芯片的推出也使得小米成爲繼蘋果、三星、華爲之後的第四家能夠自主製造手機芯片的手機廠商。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"不過澎湃S1芯片上市後有點雷聲大雨點小，銷量不佳，在市場遇冷，並沒有掀起太大的火花。在技術上，澎湃S1芯片和高通、聯發科等廠商的芯片工藝差距較大，澎湃S1芯片採用的是28nm製程，而當時主流的手機處理器已普遍採用16納米或14納米的工藝。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"此後，小米芯片一直沒怎麼有新進展出來。2018年11月，有爆料稱，澎湃S2遭遇了五次流片失敗。長期沉默狀態令人一度懷疑，小米已放棄了造芯計劃。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年8月11日，雷軍在小米十週年紀念活動的公開演講中迴應了業界關注的澎湃芯片研發情況，他表示，2017年自澎湃S1發佈後，芯片研發的確遇到了巨大困難，但請米粉們放心，這個計劃還在繼續。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在這次發佈會前三天，小米官博發佈的的預熱海報上，小米劇透“做了個小芯片”，並表示“我心澎湃”。預熱海報上的關鍵詞“我心澎湃”正是4年前小米推出自研芯片澎湃S1時所使用的slogan。這還引發了不少人的猜想，有人認爲是澎湃芯片會有新進展。有網友感嘆“時隔多年了，終於又出了”，“我以爲不研發了，現在又有新品了”..."}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.geekbang.org\/infoq\/bc\/bcb6fe4305f6b0dc5fafd0f07d5684b2.png","alt":null,"title":null,"style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":null,"fromPaste":true,"pastePass":true}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"不過，這次新推出的自研芯片並不是大家所想的那樣，不知道是否會令一些米粉感到失望。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"與澎湃S1不同，澎湃C1是一款ISP芯片，即獨立的手機影像芯片，它採用自研ISP+自研算法，可以幫助手機進行更精細、更先進的3A處理。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"另外，值得一提的是，除了手機芯片，這幾年小米的芯片戰略也在向IoT芯片轉向。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"2019年4月，小米內部一份啓動組織架構調整的郵件中提到，爲配合AIoT戰略加速落地，推動芯片研發業務更快發展，小米對負責澎湃S1處理器研發的全資子公司松果電子團隊進行了重組：其中部分團隊分拆組建新公司南京大魚半導體，並開始獨立融資，將研發方向轉向半導體領域的AI和IoT芯片與解決方案的技術研發。另一部分松果團隊繼續專注手機SoC芯片和AI芯片研發。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"造芯並非易事，註定是一場艱辛、漫長的旅程。“進入芯片行業，就是‘10億起步、苦幹10年’，這也不一定會有一個好的結果，需要持續投入，這是一場‘九死一生’的奔跑、逐夢”。此前，雷軍曾稱，澎湃S1芯片研發花費超過了10億元。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"時隔4年，澎湃芯片的“重生”也意味着小米自研芯片逐夢之旅邁入了第二個新階段，正如雷軍所說，是小米影像技術的里程碑。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"已投資超40家芯片企業，小米加速拓展芯片版圖"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"不止自主研發，這幾年小米在芯片領域的投資動作不斷，頻頻落子。以小米、聯想等爲代表的終端公司已成爲除半導體投資機構和國家產業基金之外，我國芯片領域主要的投資方之一。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米在芯片領域的投資佈局主要通過湖北小米長江產業基金開展實施。湖北小米長江產業基金，總規模爲116.1億元，由小米和湖北省長江經濟帶產業引導基金合夥企業（有限合夥）共同發起設立，用於支持小米及小米生態鏈企業的業務拓展。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null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芯片等芯片產品。其中，考慮到與自身業務特點的關聯性，物聯網芯片是小米的投資重點，在小米投資的芯片企業裏，多數企業主攻物聯網邊緣側處理器和通信芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年，伴隨着國產替代和自主可控的呼聲日益高漲，以及半導體公司迎來上市熱潮，半導體領域的投資如火如荼。2020年，也是小米芯片投資“大躍進”的一年。有數據顯示，2020年，小米投資了約30家半導體相關企業。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"2021年以來，小米已密集出手，向多家芯片企業注資。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"今年1月18日，湖北小米長江產業基金投資了帝奧微電子，該公司主營電源芯片，小米開始向高壓電源領域佈局；2月初，小米長江產業基金向芯片設計企業晶視智能投資了345萬元人民幣，併成爲其第一大股東，晶視智能主攻視頻監控及邊緣計算技術研發；沒過多久，小米又投資了高端片式多層陶瓷電容器製造企業廣東微容電子。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"有業內分析人士認爲，在自主研發芯片不太順利的情況下，投資是小米拓寬自己芯片版圖所採取的一種迂迴策略。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"頭部手機廠商瘋狂佈局芯片"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"這幾年，手機廠商競相佈局芯片研發。國外有蘋果、三星，國內有小米、華爲、OPPO、VIVO，它們正在加速芯片自研進程。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年雙十一，蘋果發佈了自研 5nm M1 芯片，結束了英特爾對蘋果筆記本電腦CPU的壟斷局面。據一位IBM高管估算，蘋果因爲M1芯片節省了約25億美元的硬件成本，另據自媒體“魔鐵的世界”計算，蘋果採用自研芯片，每年等於省出4.25個小米的利潤，大約0.78個華爲賺的錢。數據鮮明地說明了自研芯片的好處。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"國內手機廠商中，華爲早在2004年就開始投入手機芯片研發，2009年，華爲海思推出了第一款手機應用處理器K3V1，但由於策略失誤，K3V1“陣亡”在了上市前夕。一年後，華爲推出了首款支持TD-LTE的基帶處理器巴龍700，爲華爲手機的崛起打下了基礎；2014年，華爲麒麟920問世，後來又推出了升級麒麟925、麒麟980、麒麟990等，麒麟系列芯片助力華爲手機登上巔峯。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"作爲“後浪”的OPPO、VIVO，近兩三年在自研芯片上瘋狂發力。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年5月，vivo申請的2個芯片商標——“vivo SOC”和“vivo chip”被曝光。2019年10月，vivo執行副總裁胡柏山曾在接受媒體採訪時透露，早在2018年初，vivo就開始思考深度參與到5G SoC芯片的設計中。爲此，vivo招聘了大量芯片領域的人才，將組建了一支300-500人的芯片團隊，不過該芯片團隊不是純芯片研發。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在2019年初，OPPO副總裁、研究院院長劉暢在接受採訪時稱，OPPO已經具備了芯片級的技術能力，並透露在研發協處理器M1。更多的造芯計劃在2020年2月對外界披露，當時OPPO CEO 特別助理發佈內部文章《對打造核心技術的一些思考》，文中提出三大計劃，涉及軟件開發、雲，以及硬件（芯片），其中，馬里亞納計劃對標芯片研發。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"OPPO在內部文章中如是解釋造芯的初衷，“做芯片，我們實乃不得已而爲之。不管是出於 OPPO 自身的差異化需求，出於用戶對全場景科技體驗的需求，還是出於手機‘軟硬服’一體化的需求，即便是像高通、谷歌這麼優秀的合作伙伴，都很難在現階段支持我們的夢想。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"同年5月，《日經亞洲評論》報道稱，OPPO 正在加緊設計自己的移動芯片，其已從主要芯片供應商聯發科聘請了數名高管，及從紫光展銳那聘請了多位工程師，在上海組建芯片團隊。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"芯片領域的從業者們也已經深切感受到了，手機廠商大力推進自研芯片的瘋狂程度。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"一位業內人士方思淼（化名）曾向 InfoQ 透露，今年年初，某手機公司爲了方便挖人，專門在另一家做手機芯片的公司門口設立了一個辦公室，但凡是能力強的候選人，薪資翻倍不再話下。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"芯片是手機底層技術研發的核心環節。在過去很長一段時間裏，手機廠商們高度依賴芯片廠商，自己並不具備芯片能力，而目前手機芯片製造寡頭格局凸顯，未來要想不在5G時代掉隊，擁有芯片自研能力將是在激烈的競爭中取得領先優勢的關鍵。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"三星電子中國研究院院長張代軍曾預判，未來終端廠商向上遊參與到預研芯片管理環節，將成爲一種主流趨勢。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"而芯片產業技術門檻高，週期長，投入大，利潤率低的特徵，加劇了造芯之難，可謂是難於上青天。不似華爲已經在手機芯片研發領域深耕十餘年且不惜重金投入，小米、OV們目前還算是造芯的“新手”，需要歷經從0-1的過程，也需要更多的研發投入。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米在研發投入上一向偏低，在總營收中的佔比幾乎從未超過4%，對比華爲，華爲的研發投入在總營收中的佔比長期在10%-15%。可見的變化正在發生。這幾年小米頻頻對外提及要加大研發投入。在去年的小米開發者大會上，雷軍提到，今年小米2020年研發投入會超過 100 億元，研發投入在科創板所有上市公司研發成本總和的一半。未來還會死磕硬科技。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"這次全新自研芯片的推出，也是小米加強技術創新技術研發的例證。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"全球手機芯片奇缺，自研纔是出路"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"當下，全球手機廠商所面臨的一個重大挑戰就是缺芯問題。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"中信證券《智能手機行業深度追蹤2021》報告顯示，先進製程資源緊缺、手機需求復甦 、下游應用競爭共同加劇芯片缺貨 ，預計缺芯問題將持續全年。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"報告顯示，半導體行業整體芯片缺貨，主要手機芯片廠商均受影響，手機主芯片及周邊芯片供貨週期拉長 、價格上漲。在高通受限於晶圓代工產能喫緊之際，小米和OPPO等手機制造商已經轉向聯發科購買芯片產品。其中，小米採用高通芯片的比重已下滑25%，從此前的80%降至55%。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"芯片短缺已造成本季度小米智能手機出貨量與營收的環比下滑，不及市場預期。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"3月24日，小米公佈的2020年第四季度和全年業績報告顯示，2020年Q4季度，小米智能手機收入426億元，小米全球智能手機出貨量爲4230萬臺；2020年Q3季度，小米智能手機部分收入476億元，另據IDC2020年Q3全球智能機市場統計報告顯示，小米Q3季度出貨量爲4650萬部。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米集團總裁王翔迴應小米Q4季度營收不及預期時表示，Q4季度營收增長放緩的核心原因在於芯片缺貨。2020年第四季度集團就開始面臨芯片缺貨的挑戰，也因此影響了業績。他表示，小米正在與核心供應商日以繼夜的優化供應鏈、提高生產效率，2021年前兩個季度小米智能手機生產整體表現良好。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"此前，小米集團副總裁盧偉冰曾在微博感嘆，“今年芯片太缺了，不是缺，是極缺”。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"當下全球芯片短缺壓力山大，加之，中美貿易關係充滿不確定性，華爲芯片被禁事件敲響警鐘，國內高端芯片生產自主化問題備受關注，國產芯片廠商正在加大研發力度，而對於國產大手機廠商來說，開始佈局自研芯片是緩解“缺芯”之痛的一種解決方案。小米新款自研芯片的推出，也爲國產自研芯片注入了新的力量。"}]}]}