沉寂4年后，小米自研澎湃芯片终于归来，但可能有些失望了

{"type":"doc","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"blockquote","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"雷军表示，从澎湃芯片立项到2017年发布澎湃S1，直到今天澎湃C1的发布，小米的芯片之路走了7年。期间，小米历经挫折和突破。"}]}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"小米正式发布自研图像处理芯片"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"沉寂许久的小米造芯计划，终于有了新动静。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"3月30日晚，在小米春季新品发布会（第二场）现场，小米正式发布了自研的图像处理芯片— 澎湃C1。这是小米首款专业影像芯片。澎湃C1是一颗由小米自研的图像信号芯片，作为手机影像的“大脑”，它脱离SoC, 独立在主板之上。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.infoq.cn\/resource\/image\/b1\/25\/b137cd88dc73c048c4f967453c3bdc25.jpeg","alt":null,"title":"","style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":"","fromPaste":false,"pastePass":false}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃C1芯片是小米自研ISP+自研算法的结果，澎湃 C1 采用更精细且更先进的3A处理。据小米官方介绍，这个3A指的是的AF对焦、AWB白平衡及AE自动曝光，拥有双滤波器的澎湃C1可以实现高低频信号并行处理，信号处理效率提升100%，3A表现大幅提升。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃C1是由小米研发，交予台积电成片的一颗芯片。澎湃C1芯片具有高性能、低CPU和内存占用特性，在3A算法、暗光对焦能力和画质上进行提升，带来更准确的自动白平衡、自动对焦、自动曝光和成像质量。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"bulletedlist","content":[{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"更好的自动对焦（AF），大幅提升暗光、小物体及平坦区域的对焦能力；"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"更精准的白平衡（AWB） ，复杂混合环境光也完全驾驭；"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"更准确的自动曝光（AE）策略。"}]}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"strong"}],"text":"该款芯片已经应用在此次小米发布的新品手机 — 小米MIX FOLD上，预计后面还会有更多手机用上这款芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米MIX FOLD是小米首款折叠屏手机其采用内折设计，拥有内外两块屏幕。核心硬件方面，小米MIX Fold搭载了高通骁龙888处理器，辅以LPDDR5+UFS 3.1的内存组合。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"strong"}],"text":"雷军表示，小米2014年立项做澎湃芯片，2017年发布澎湃S1，直到今天澎湃C1的发布，小米的芯片之路走了7年。期间，小米历经挫折和突破 ，澎湃C1只是小米芯片的一小步，同时也是小米影像技术的里程碑。芯片这条路很漫长，小米心怀敬畏，这条路充满险阻，但小米会一直努力做下去。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.infoq.cn\/resource\/image\/1e\/cd\/1e9aee9a025e41925ec3c91f123b3acd.jpeg","alt":null,"title":"","style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":"","fromPaste":false,"pastePass":false}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"尽管这次新芯片是负责图像处理的ISP，但研发难度也不低，小米介绍，这颗芯片是小米耗时2年投入1.4亿研发费用打造的产品。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"小米的7年造芯梦"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米的造芯梦始于2014年。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"当年，小米成立了松果电子公司，负责芯片研发设计。“芯片是手机科技的制高点，小米要成为伟大的公司，必须要掌握核心技术。”雷军曾如是解释，小米为什么要自研芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"为实现这个目标，小米不惜大手笔投入。小米斥资1.03亿从联芯科技买下了SDR1860 平台技术，并从各个芯片厂商开出高薪挖人组建起了芯片研发团队。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米首款芯片产品是澎湃S1芯片，不同于小米产品“极致性价比”的基因，小米芯片一出手就定位中高端，雷军曾表示， “如果把芯片分为旗舰、高端、中端和入门级的话，我们的目标是对标高端”。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃S1芯片自2014年开始研发。2017年2月，小米澎湃S1芯片正式发布，并搭载于小米5C手机上。澎湃S1芯片从立项到量产商用仅用了28个月的时间，要知道手机处理器的研发周期至少需要2年时间，例如，华为的麒麟980，研发周期就长达3年时间。当时，澎湃S1如此短的研发周期颇令外界侧目。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"澎湃S1芯片的推出也使得小米成为继苹果、三星、华为之后的第四家能够自主制造手机芯片的手机厂商。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"不过澎湃S1芯片上市后有点雷声大雨点小，销量不佳，在市场遇冷，并没有掀起太大的火花。在技术上，澎湃S1芯片和高通、联发科等厂商的芯片工艺差距较大，澎湃S1芯片采用的是28nm制程，而当时主流的手机处理器已普遍采用16纳米或14纳米的工艺。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"此后，小米芯片一直没怎么有新进展出来。2018年11月，有爆料称，澎湃S2遭遇了五次流片失败。长期沉默状态令人一度怀疑，小米已放弃了造芯计划。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年8月11日，雷军在小米十周年纪念活动的公开演讲中回应了业界关注的澎湃芯片研发情况，他表示，2017年自澎湃S1发布后，芯片研发的确遇到了巨大困难，但请米粉们放心，这个计划还在继续。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在这次发布会前三天，小米官博发布的的预热海报上，小米剧透“做了个小芯片”，并表示“我心澎湃”。预热海报上的关键词“我心澎湃”正是4年前小米推出自研芯片澎湃S1时所使用的slogan。这还引发了不少人的猜想，有人认为是澎湃芯片会有新进展。有网友感叹“时隔多年了，终于又出了”，“我以为不研发了，现在又有新品了”..."}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.geekbang.org\/infoq\/bc\/bcb6fe4305f6b0dc5fafd0f07d5684b2.png","alt":null,"title":null,"style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":null,"fromPaste":true,"pastePass":true}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"不过，这次新推出的自研芯片并不是大家所想的那样，不知道是否会令一些米粉感到失望。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"与澎湃S1不同，澎湃C1是一款ISP芯片，即独立的手机影像芯片，它采用自研ISP+自研算法，可以帮助手机进行更精细、更先进的3A处理。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"另外，值得一提的是，除了手机芯片，这几年小米的芯片战略也在向IoT芯片转向。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"2019年4月，小米内部一份启动组织架构调整的邮件中提到，为配合AIoT战略加速落地，推动芯片研发业务更快发展，小米对负责澎湃S1处理器研发的全资子公司松果电子团队进行了重组：其中部分团队分拆组建新公司南京大鱼半导体，并开始独立融资，将研发方向转向半导体领域的AI和IoT芯片与解决方案的技术研发。另一部分松果团队继续专注手机SoC芯片和AI芯片研发。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"造芯并非易事，注定是一场艰辛、漫长的旅程。“进入芯片行业，就是‘10亿起步、苦干10年’，这也不一定会有一个好的结果，需要持续投入，这是一场‘九死一生’的奔跑、逐梦”。此前，雷军曾称，澎湃S1芯片研发花费超过了10亿元。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"时隔4年，澎湃芯片的“重生”也意味着小米自研芯片逐梦之旅迈入了第二个新阶段，正如雷军所说，是小米影像技术的里程碑。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"已投资超40家芯片企业，小米加速拓展芯片版图"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"不止自主研发，这几年小米在芯片领域的投资动作不断，频频落子。以小米、联想等为代表的终端公司已成为除半导体投资机构和国家产业基金之外，我国芯片领域主要的投资方之一。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米在芯片领域的投资布局主要通过湖北小米长江产业基金开展实施。湖北小米长江产业基金，总规模为116.1亿元，由小米和湖北省长江经济带产业引导基金合伙企业（有限合伙）共同发起设立，用于支持小米及小米生态链企业的业务拓展。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null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芯片等芯片产品。其中，考虑到与自身业务特点的关联性，物联网芯片是小米的投资重点，在小米投资的芯片企业里，多数企业主攻物联网边缘侧处理器和通信芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年，伴随着国产替代和自主可控的呼声日益高涨，以及半导体公司迎来上市热潮，半导体领域的投资如火如荼。2020年，也是小米芯片投资“大跃进”的一年。有数据显示，2020年，小米投资了约30家半导体相关企业。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"2021年以来，小米已密集出手，向多家芯片企业注资。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"今年1月18日，湖北小米长江产业基金投资了帝奥微电子，该公司主营电源芯片，小米开始向高压电源领域布局；2月初，小米长江产业基金向芯片设计企业晶视智能投资了345万元人民币，并成为其第一大股东，晶视智能主攻视频监控及边缘计算技术研发；没过多久，小米又投资了高端片式多层陶瓷电容器制造企业广东微容电子。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"有业内分析人士认为，在自主研发芯片不太顺利的情况下，投资是小米拓宽自己芯片版图所采取的一种迂回策略。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"头部手机厂商疯狂布局芯片"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"这几年，手机厂商竞相布局芯片研发。国外有苹果、三星，国内有小米、华为、OPPO、VIVO，它们正在加速芯片自研进程。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年双十一，苹果发布了自研 5nm M1 芯片，结束了英特尔对苹果笔记本电脑CPU的垄断局面。据一位IBM高管估算，苹果因为M1芯片节省了约25亿美元的硬件成本，另据自媒体“魔铁的世界”计算，苹果采用自研芯片，每年等于省出4.25个小米的利润，大约0.78个华为赚的钱。数据鲜明地说明了自研芯片的好处。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"国内手机厂商中，华为早在2004年就开始投入手机芯片研发，2009年，华为海思推出了第一款手机应用处理器K3V1，但由于策略失误，K3V1“阵亡”在了上市前夕。一年后，华为推出了首款支持TD-LTE的基带处理器巴龙700，为华为手机的崛起打下了基础；2014年，华为麒麟920问世，后来又推出了升级麒麟925、麒麟980、麒麟990等，麒麟系列芯片助力华为手机登上巅峰。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"作为“后浪”的OPPO、VIVO，近两三年在自研芯片上疯狂发力。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"去年5月，vivo申请的2个芯片商标——“vivo SOC”和“vivo chip”被曝光。2019年10月，vivo执行副总裁胡柏山曾在接受媒体采访时透露，早在2018年初，vivo就开始思考深度参与到5G SoC芯片的设计中。为此，vivo招聘了大量芯片领域的人才，将组建了一支300-500人的芯片团队，不过该芯片团队不是纯芯片研发。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在2019年初，OPPO副总裁、研究院院长刘畅在接受采访时称，OPPO已经具备了芯片级的技术能力，并透露在研发协处理器M1。更多的造芯计划在2020年2月对外界披露，当时OPPO CEO 特别助理发布内部文章《对打造核心技术的一些思考》，文中提出三大计划，涉及软件开发、云，以及硬件（芯片），其中，马里亚纳计划对标芯片研发。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"OPPO在内部文章中如是解释造芯的初衷，“做芯片，我们实乃不得已而为之。不管是出于 OPPO 自身的差异化需求，出于用户对全场景科技体验的需求，还是出于手机‘软硬服’一体化的需求，即便是像高通、谷歌这么优秀的合作伙伴，都很难在现阶段支持我们的梦想。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"同年5月，《日经亚洲评论》报道称，OPPO 正在加紧设计自己的移动芯片，其已从主要芯片供应商联发科聘请了数名高管，及从紫光展锐那聘请了多位工程师，在上海组建芯片团队。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"芯片领域的从业者们也已经深切感受到了，手机厂商大力推进自研芯片的疯狂程度。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"一位业内人士方思淼（化名）曾向 InfoQ 透露，今年年初，某手机公司为了方便挖人，专门在另一家做手机芯片的公司门口设立了一个办公室，但凡是能力强的候选人，薪资翻倍不再话下。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"芯片是手机底层技术研发的核心环节。在过去很长一段时间里，手机厂商们高度依赖芯片厂商，自己并不具备芯片能力，而目前手机芯片制造寡头格局凸显，未来要想不在5G时代掉队，拥有芯片自研能力将是在激烈的竞争中取得领先优势的关键。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"三星电子中国研究院院长张代军曾预判，未来终端厂商向上游参与到预研芯片管理环节，将成为一种主流趋势。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"而芯片产业技术门槛高，周期长，投入大，利润率低的特征，加剧了造芯之难，可谓是难于上青天。不似华为已经在手机芯片研发领域深耕十余年且不惜重金投入，小米、OV们目前还算是造芯的“新手”，需要历经从0-1的过程，也需要更多的研发投入。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米在研发投入上一向偏低，在总营收中的占比几乎从未超过4%，对比华为，华为的研发投入在总营收中的占比长期在10%-15%。可见的变化正在发生。这几年小米频频对外提及要加大研发投入。在去年的小米开发者大会上，雷军提到，今年小米2020年研发投入会超过 100 亿元，研发投入在科创板所有上市公司研发成本总和的一半。未来还会死磕硬科技。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"这次全新自研芯片的推出，也是小米加强技术创新技术研发的例证。"}]},{"type":"heading","attrs":{"align":null,"level":3},"content":[{"type":"text","text":"全球手机芯片奇缺，自研才是出路"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"当下，全球手机厂商所面临的一个重大挑战就是缺芯问题。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"中信证券《智能手机行业深度追踪2021》报告显示，先进制程资源紧缺、手机需求复苏 、下游应用竞争共同加剧芯片缺货 ，预计缺芯问题将持续全年。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"报告显示，半导体行业整体芯片缺货，主要手机芯片厂商均受影响，手机主芯片及周边芯片供货周期拉长 、价格上涨。在高通受限于晶圆代工产能吃紧之际，小米和OPPO等手机制造商已经转向联发科购买芯片产品。其中，小米采用高通芯片的比重已下滑25%，从此前的80%降至55%。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"芯片短缺已造成本季度小米智能手机出货量与营收的环比下滑，不及市场预期。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"3月24日，小米公布的2020年第四季度和全年业绩报告显示，2020年Q4季度，小米智能手机收入426亿元，小米全球智能手机出货量为4230万台；2020年Q3季度，小米智能手机部分收入476亿元，另据IDC2020年Q3全球智能机市场统计报告显示，小米Q3季度出货量为4650万部。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米集团总裁王翔回应小米Q4季度营收不及预期时表示，Q4季度营收增长放缓的核心原因在于芯片缺货。2020年第四季度集团就开始面临芯片缺货的挑战，也因此影响了业绩。他表示，小米正在与核心供应商日以继夜的优化供应链、提高生产效率，2021年前两个季度小米智能手机生产整体表现良好。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"此前，小米集团副总裁卢伟冰曾在微博感叹，“今年芯片太缺了，不是缺，是极缺”。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"当下全球芯片短缺压力山大，加之，中美贸易关系充满不确定性，华为芯片被禁事件敲响警钟，国内高端芯片生产自主化问题备受关注，国产芯片厂商正在加大研发力度，而对于国产大手机厂商来说，开始布局自研芯片是缓解“缺芯”之痛的一种解决方案。小米新款自研芯片的推出，也为国产自研芯片注入了新的力量。"}]}]}