IBM造出首顆2nm芯片，GAA終於接棒FinFET

{"type":"doc","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"IBM 站到世界的最前沿，芯片產業迎來又一個里程碑，摩爾定律再次被拯救，這就是2021年5月6日，全球芯片產業界所發生的事。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"當日，IBM 於"},{"type":"link","attrs":{"href":"https:\/\/newsroom.ibm.com\/2021-05-06-IBM-Unveils-Worlds-First-2-Nanometer-Chip-Technology,-Opening-a-New-Frontier-for-Semiconductors","title":null,"type":null},"content":[{"type":"text","text":"官網"}],"marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"宣佈推出全球首創的2納米芯片技術，“爲半導體產業開闢了新的領域”。當下，業內只有臺積電、三星實現了 3nm 製程芯片的研發，且尚未實現量產，2nm 芯片確爲業界首創。根據外媒披露的情況來看，IBM 2nm 芯片的晶體管密度可以達到每平方毫米3.33億個(MTr\/mm2)。同時，從 IBM 官網披露的圖片來看，該2nm芯片採用了GAA（Gate-All-Around，環繞柵極晶體管）工藝，也爲該項工藝後續的普及打下了堅實的基礎。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"embedcomp","attrs":{"type":"table","data":{"content":"

最高晶體管密度 (MTr\/mm2)
AnandTech	IBM	臺積電	英特爾	三星
22納米			16.50
16納米\/14納米		28.88	44.67	33.32
10納米		52.51	100.76	51.82
7納米		91.20	237.18*	95.08
5納米		171.30
3納米		292.21*
2納米	333.33
數據來自Wikichip，不同代工廠商可能採用不同的計數方法 * 表中所列，爲邏輯密度"}}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":"center","origin":null},"content":[{"type":"text","marks":[{"type":"size","attrs":{"size":9}},{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"由外媒整理的晶體管密度對比參考"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":"center","origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"heading","attrs":{"align":null,"level":4},"content":[{"type":"text","text":"從3nm到2nm，GAA纔是這一事件的核心"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"2nm芯片研製成功，意味着各項指標都會出現大幅提升。IBM 對外表示：“"},{"type":"text","marks":[{"type":"color","attrs":{"color":"#323232","name":"user"}}],"text":"與當今最先進的7 nm節點芯片相比，預計它將實現45％的性能提高或75％的能耗降低。”公告同時貼出了更加具體的潛在性能優勢對比："}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"bulletedlist","content":[{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"手機電池壽命增加三倍，僅要求用戶每四天爲設備充電一次。"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"削減數據中心的碳足跡（"},{"type":"text","marks":[{"type":"color","attrs":{"color":"#4d5156","name":"user"}}],"text":"指由個人、事件、組織、服務或產品造成的溫室氣體總排放量"},{"type":"text","text":"），這些數據中心佔全球能源使用量的百分之一；"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"更快地處理應用程序，更快地訪問互聯網，極大增強筆記本電腦的功能。"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"有助於 自動駕駛汽車加快物體檢測速度，降低反應時間。"}]}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"實際上，在芯片設計階段，最重要的指標就是“"},{"type":"link","attrs":{"href":"https:\/\/www.zhihu.com\/zvideo\/1342452241006153728","title":"xxx","type":null},"content":[{"type":"text","text":"PPA"}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"”，即Power（功耗）、Performance（性能）、Area（面積），但三者很難兼備，實際產品往往與宣傳效果相去甚遠。“服務器\/FPGA一般更重視性能，手機芯片一般重視價格和功耗”，前ARM公司基礎設施事業線高級產品經理、某大廠前高級產品經理邵巍博士簡明地總結道。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"但即便如此，以上性能提升和能耗降低指標，對於整個半導體行業而言，仍然是非常重要的創新和飛躍。問題是，這在短時間內仍然無法實現。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"首先，研製成功不等於量產成功。前ARM公司基礎設施事業線高級產品經理、某大廠前高級產品經理邵巍博士表示：“在IBM（發佈）的新聞中，沒有提到良率問題，因此整個業界什麼時候能夠真正用上2nm的製程，還需要等待量產的消息。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"此外，“新聞中也漏掉了常見的客戶背書環節，因此推測一下，暫時還無客戶。在無客戶的情況下， 很難推測從研製到量產需要多久”，邵巍博士補充道。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"況且，2nm 芯片因工藝特殊，對光刻機的要求也更爲苛刻。有消息稱，荷蘭 ASML 公司的全新一代光刻機預計到 2025 年量產，其 NA值提升到 0.5 ，很可能足以支撐 2nm 支撐芯片的量產。如果消息屬實，意味着，到2025年產業界才具備 2nm 芯片的基礎量產條件。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"相比之下，該芯片對 GAA 工藝的應用實踐，反而更具意義。什麼是 GAA 呢？Nerissa Draeger博士在此前的一篇採訪中形容的較爲簡潔易懂：“"},{"type":"link","attrs":{"href":"https:\/\/www.bilibili.com\/read\/cv8275344","title":"xxx","type":null},"content":[{"type":"text","text":"環繞柵極晶體管 (GAA) "}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"是一種經過改良的晶體管結構，其中通道的所有面都與柵極接觸，這樣就可以實現連續縮放。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"與GAA相對應的是"},{"type":"link","attrs":{"href":"https:\/\/baike.baidu.com\/item\/%E9%B3%8D%E5%BC%8F%E5%9C%BA%E6%95%88%E5%BA%94%E6%99%B6%E4%BD%93%E7%AE%A1\/23200647?fromtitle=FinFET&fromid=5883551&fr=aladdin","title":"xxx","type":null},"content":[{"type":"text","text":"FinFET（鰭式場效應晶體管）"}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"，FinFET是芯片從22nm逐步進軍7nm、5nm的關鍵工藝，其發明人胡正明教授因此被稱作“挽救了摩爾定律的男人”。可在進入 7nm 以下後，FinFET逼近極限，產業界迫切需要新的工藝技術。這時，GAA 出現了。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"三星對 GAA 極爲推崇，但“老大哥”臺積電則求穩不求快。去年 8 月，臺積電對外表示，公司的 3nm 將繼續沿用之前的 FinFET，這也爲GAA的落地、普及蒙上了一層陰影。此次 IBM 2nm GAA 芯片的問世，等於徹底打通了從3nm到2nm的路徑。此前，人們還在猶豫：GAA能否替代FinFET？如今，這樣的疑問隨着 2nm 芯片的問世煙消雲散。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"“這是一個大進步，對於整個半導體業界來說，算是對GAA技術的雙保險，至少工藝製程演進到3nm\/2nm不存在太多障礙了，可喜可賀。”邵巍博士在採訪中高興地說道。"}]},{"type":"heading","attrs":{"align":null,"level":4},"content":[{"type":"text","text":"臺積電、三星、英特爾的三強之爭"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"IBM 本身並不具備量產芯片的條件和能力， 其 2nm 芯片會通過授權的形式，交給高端芯片代工廠商來完成。這本來不是什麼了不得的事，僅僅是產業鏈分工細化的表現。但對於臺積電而言，事情就沒那麼簡單了。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"臺積電（TSMC）創始人張忠謀在“2021大師智庫論壇”曾表示，臺積電最大的競爭對手仍然是三星。而雙方也確實在 3nm 芯片這一陣地劍拔弩張。據媒體報道，三星曾對外宣佈未來10年投資超1000億美元，目標到2025年在芯片製造領域內保持領先。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"不過現實往往不遂人願，雖然三星自稱在2002年就對GAA保持關注並投入研究，但其3nm GAA 芯片的量產至今仍無確切時間。反觀臺積電，3nm FinFET 芯片預計 2022 就可以實現量產，2nm GAA芯片也在研製中。看樣子，臺積電還將穩坐全球芯片代工第一的寶座。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"但此時與三星保持良好合作關係的 IBM ，突然宣佈 2nm GAA 芯片研製成功，將局勢逆轉，對臺積電的既定規劃造成了衝擊。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"除了三星，英特爾也很可能參與到代工生產中來，況且英特爾入局代工生意本就屬於“突襲”，此前英特爾新任 CEO 帕特・基辛格更是宣稱 2 年內超越臺積電。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"競爭更加激烈，局勢更加複雜，這就是臺積電面對的未來市場。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"好在臺積電的真正命脈在於蘋果、高通的大筆訂單。只要做好小步快跑，短期內並不會因爲 IBM 2nm 芯片的出現收到較大沖擊。“大家（代工廠商與客戶）一般都會提前對齊3-5年的目標，蘋果不會介意 2nm\/3nm這種名字，對齊的都是跟細節的參數”，邵巍博士對InfoQ記者說道，“蘋果那個產能需求量， 誰接了單，都得加工廠、加生產線， 至少提前2年。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"對於臺積電而言，真正的戰役可能不在當下，而是在未來的 3 - 5 年內，與“挑戰者”三星來一場針尖對麥芒的比拼。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"strong"}],"text":"嘉賓介紹："}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"邵巍，"},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"前ARM公司基礎設施事業線高級產品經理，某大廠前高級產品經理"},{"type":"text","text":"。"}]}]}