Industry Insight
Flip-chip refers to semiconductors that are mounted with the active side down. Flip chip assembly offers many advantages. A key advantage is improved electrical performance. The small bumps of Flip Chip Market interconnection provide short electrical paths, which yield excellent electrical properties with low capacitance, inductance, and resistance. This results in greatly improved high-frequency performance compared to other interconnection methods such as chip-and-wire. Another important advantage of flip-chip assembly is its compactness. The electrical connection pads on the chip and substrate surfaces can be laid out as an area array, rather than around the periphery of the chip. This 2D-array structure can save chip space and reduce the footprint of the chip on the substrate.
Flip chip assembly has gained acceptance in a wide range of low-end and high-end electronic products. Miniaturization, enhanced the electrical performance, and high interconnection density are driving the applications of this technology. Many wireless device suppliers are expanding their use of Flip Chip Technology to high-end ICs. For instance, 75% of new ASIC designs are now in the flip chip format, and this percentage is increasing.
Existing 2-D integrated circuit (2.0DIC) flip-chip and wafer-level packaging technologies have shown solid growth over the past five years and are used in a number of mainstream applications predominantly in high-end smartphones. Flip chip packaging involves applying soldered bumps on the top side of a fabricated wafer, the integrated circuit can then be flipped and aligned with grooves on an external circuit to enable the necessary connections. This form of packaging occupies less space in products and offers higher input/ output rates because the whole surface area of the chip can be used for interconnection.
Get Sample Report @ https://www.marketresearchfuture.com/sample_request/5381
Key players
Some of the major players in flip chip technology market are Samsung Group (South Korea), Intel Corporation (U.S.), GlobalFoundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.
Segmentation:
The global flip chip technology market is segmented on the basis of wafer bumping process, packaging technology, packaging type, product, application, and region. On the basis of the wafer bumping process, the segment is further classified into copper (CU) pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder. On the basis of the packaging technology, the market is further classified into 2D, 2.5D, and 3D packaging technology. On the basis of the packaging type, the market is further classified into FC BGA (Flip Chip Ball Grid Array), FC PGA (Flip Chip Pin Grid Array), FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-Package), and FC CSP (Flip Chip-Chip-Scale Package). On the basis of the product the segment is further classified into LED, CMOS image sensor, CPU, RF, Analog, Mixed Signal, and Power IC, SoC and others. Flip chip technology is widely used in many areas such as consumer electronics, automotive, telecommunications, industrial, medical devices, military and aerospace and others.
Regional Analysis
The flip chip technology market in Asia Pacific region is expected to grow at the highest CAGR over the forecast period. With the rising technological innovation, competition and M&A activities in the industry, many local and regional vendors are offering specific application products to varied end-users, which make the Asia Pacific market a global leader in flip chip technology. The advantages of using flip chip technology in navy and consumer electronics industry have encouraged to adopt this flip chip technology in North America.
Get Complete Report @ https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381
Read More Reports by MRFR:
Portable Scanners Market
https://www.marketresearchfuture.com/reports/portable-scanner-market-6103
Laser Tracker Market
https://www.marketresearchfuture.com/reports/laser-tracker-market-6112
GaAs Wafer Market
https://www.marketresearchfuture.com/reports/gaas-wafer-market-6473
*If you have any special requirements, please let us know and we will offer you the report as you want.
About Market Research Future:
At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.
MRFR team have supreme objective to provide the optimum quality market research and intelligence services to our clients. Our market research studies by products, services, technologies, applications, end users, and market players for global, regional, and country level market segments, enable our clients to see more, know more, and do more, which help to answer all their most important questions.
Contact:
Market Research Future (Part of Wantstats Research and Media Private Limited)
99 Hudson Street, 5Th Floor
New York, NY 10013
United States of America
+1 628 258 0071 (US)
+44 2035 002 764 (UK)
Email: [email protected]
Website: https://www.marketresearchfuture.com