臺積電美國建廠新進展：拿到兩億美元補貼做基建

{"type":"doc","content":[{"type":"blockquote","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"今年6月份，臺積電答應在美國建設用以生產 5nm 芯片的新工廠。預計該項目 2021 年至 2029 年的總支出約 120 億美元。根據最新消息，美國亞利桑那州菲尼克斯市（鳳凰城）政府將提供2.05億美元城市建設基金。"}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"heading","attrs":{"align":null,"level":2},"content":[{"type":"text","text":"廠房所在地政府將提供2.05億美元"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"根據協議，臺積電美國廠房所在市也就是美國亞利桑那州菲尼克斯市（鳳凰城）政府將提供2.05億美元城市建設基金，用於廠房建設相關的水、路等基礎設施改造和建設。臺積電計劃在該市投資120億美元建設一個半導體工廠，據稱目前正在選址、協議商討和簽署過程中。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"關於2.05億美元的具體歸屬爲6100萬美元建設一條三英里長的街道，3700萬美元改善供水基礎設施，1.07億美元進行廢水改造。在選擇好具體地點之後，臺積電將與菲尼克斯市簽署正式投資協議，而這一切預計都將在今年底之前完成。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"菲尼克斯政務會以9比0的投票表決結果批准了上述協議。投票前，菲尼克斯市長凱特·加萊戈（Kate Gallego）表示，該協議“在幫助推動亞利桑那州成爲先進製造業領導者方面將發揮重要作用，而我們的政府在爭取該項目的工作中取得了巨大的成功。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"根據協議，這座新工廠將分階段在五年內完成，該工廠將創造1900個全職工作新崗位，建設工作於2021年初開始。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"此外，臺積電總公司表示也希望獲得來自美國聯邦一級政府的補貼，以幫助支付在美國製造芯片的額外費用。截至目前，全球大多數製程先進的半導體芯片都是在中國臺灣製造，其中包括那些在美國軍事裝備中使用的半導體芯片產品。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"今年6月份，美國提議拿出數十億美元補助資金，幫助支持半導體制造業發展。這些補助資金可能會讓臺積電、英特爾和美光等科技公司受益。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在今年中舉辦的股東大會上，臺積電的董事長劉德音對投資人表示："},{"type":"text","marks":[{"type":"strong"}],"text":"在美國建廠絕對符合公司利益，這將幫助公司獲得客戶信任並有助於擴大其人才庫。"}]},{"type":"heading","attrs":{"align":null,"level":2},"content":[{"type":"text","text":"硝煙中的自救？"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"近兩年，中美關係緊張，尤其體現在芯片領域。作爲目前全球第一的芯片代工廠，臺積電的營收不僅未受影響，還節節攀高。財報顯示，第三季度臺積電營收達到121.4億美元(約合815.89億元人民幣)，再次創下了新高。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.infoq.cn\/resource\/image\/7f\/67\/7f0b46f9df4e7cb68a3b03c1b1d6bd67.jpg","alt":null,"title":"","style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":"","fromPaste":false,"pastePass":false}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"從各工藝製程貢獻的營收佔比來看，7nm的營收佔比最高爲35%；最新的5nm工藝首次貢獻營收，佔比達到了8%；16nm佔比18%，與上個季度持平；10nm已經連續兩個季度貢獻爲零；16nm以上的成熟製程佔比下滑至39%。根據現有信息來看，臺積電5nm營收的主要客戶爲蘋果和華爲。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"雖然美國的一系列芯片禁令可能會讓臺積電從華爲等中國廠商獲得的訂單金額驟減，但蘋果、高通、聯發科、超微等已經陸續被媒體曝出向臺積電大幅追加訂單，甚至蘋果今年下半年乃至未來一年的所有芯片訂單基本被臺積電壟斷。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在今年中的股東大會上，臺積電對芯片禁令的迴應是："},{"type":"text","marks":[{"type":"strong"}],"text":"如果禁令得到實施，將會很快填補因美國最新禁令而造成的訂單缺口（主要是無法出售給華爲芯片），但很難預測有多快。"},{"type":"text","text":" "},{"type":"text","text":"現在看來，蘋果、高通等公司的訂單增加可以迅速讓臺積電填補空缺。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"最後，臺積電在先進製程探索以及封裝技術方面的工藝確實超過競爭對手太多，這也爲臺積電帶來了更多的大客戶訂單。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"根據最新消息顯示，臺積電正在與谷歌等美國客戶共同測試、開發一種先進的“整合芯片”封裝技術，並計劃於 2022 年量產。"},{"type":"text","text":"屆時，谷歌及 AMD 將成爲其第一批客戶，"},{"type":"text","text":"谷歌"},{"type":"text","text":"計劃將最新技術的芯片用於自動駕駛，而 AMD 則希望藉此加大在與"},{"type":"text","text":"英特爾"},{"type":"text","text":"之間競爭勝出的概率。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"臺積電將此 3D 封裝技術命名爲“SoIC（System on Integrated Chips）”，該方案可以實現將幾種不同類型的芯片（例如處理器、內存或傳感器）堆疊和鏈接到一個封裝實體之中，因此得到的芯片尺寸更小，性能更強，能耗也更低。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"多名消息人士稱，此技術將有助於半導體產業改變當前摩爾定律難以延續的現狀。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"參考鏈接："}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"link","attrs":{"href":"https:\/\/www.infoq.cn\/article\/Lw6O4deaOh1yRuC2jsLX","title":"","type":null},"content":[{"type":"text","text":"https:\/\/www.infoq.cn\/article\/Lw6O4deaOh1yRuC2jsLX"}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"link","attrs":{"href":"https:\/\/www.reuters.com\/article\/us-tsmc-arizona\/phoenix-okays-development-deal-with-tsmc-for-12-billion-chip-factory-idUKKBN27Y30E","title":"","type":null},"content":[{"type":"text","text":"https:\/\/www.reuters.com\/article\/us-tsmc-arizona\/phoenix-okays-development-deal-with-tsmc-for-12-billion-chip-factory-idUKKBN27Y30E"}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}}]}