台积电美国建厂新进展：拿到两亿美元补贴做基建

{"type":"doc","content":[{"type":"blockquote","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"今年6月份，台积电答应在美国建设用以生产 5nm 芯片的新工厂。预计该项目 2021 年至 2029 年的总支出约 120 亿美元。根据最新消息，美国亚利桑那州菲尼克斯市（凤凰城）政府将提供2.05亿美元城市建设基金。"}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"heading","attrs":{"align":null,"level":2},"content":[{"type":"text","text":"厂房所在地政府将提供2.05亿美元"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"根据协议，台积电美国厂房所在市也就是美国亚利桑那州菲尼克斯市（凤凰城）政府将提供2.05亿美元城市建设基金，用于厂房建设相关的水、路等基础设施改造和建设。台积电计划在该市投资120亿美元建设一个半导体工厂，据称目前正在选址、协议商讨和签署过程中。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"关于2.05亿美元的具体归属为6100万美元建设一条三英里长的街道，3700万美元改善供水基础设施，1.07亿美元进行废水改造。在选择好具体地点之后，台积电将与菲尼克斯市签署正式投资协议，而这一切预计都将在今年底之前完成。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"菲尼克斯政务会以9比0的投票表决结果批准了上述协议。投票前，菲尼克斯市长凯特·加莱戈（Kate Gallego）表示，该协议“在帮助推动亚利桑那州成为先进制造业领导者方面将发挥重要作用，而我们的政府在争取该项目的工作中取得了巨大的成功。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"根据协议，这座新工厂将分阶段在五年内完成，该工厂将创造1900个全职工作新岗位，建设工作于2021年初开始。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"此外，台积电总公司表示也希望获得来自美国联邦一级政府的补贴，以帮助支付在美国制造芯片的额外费用。截至目前，全球大多数制程先进的半导体芯片都是在中国台湾制造，其中包括那些在美国军事装备中使用的半导体芯片产品。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"今年6月份，美国提议拿出数十亿美元补助资金，帮助支持半导体制造业发展。这些补助资金可能会让台积电、英特尔和美光等科技公司受益。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在今年中举办的股东大会上，台积电的董事长刘德音对投资人表示："},{"type":"text","marks":[{"type":"strong"}],"text":"在美国建厂绝对符合公司利益，这将帮助公司获得客户信任并有助于扩大其人才库。"}]},{"type":"heading","attrs":{"align":null,"level":2},"content":[{"type":"text","text":"硝烟中的自救？"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"近两年，中美关系紧张，尤其体现在芯片领域。作为目前全球第一的芯片代工厂，台积电的营收不仅未受影响，还节节攀高。财报显示，第三季度台积电营收达到121.4亿美元(约合815.89亿元人民币)，再次创下了新高。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.infoq.cn\/resource\/image\/7f\/67\/7f0b46f9df4e7cb68a3b03c1b1d6bd67.jpg","alt":null,"title":"","style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":"","fromPaste":false,"pastePass":false}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"从各工艺制程贡献的营收占比来看，7nm的营收占比最高为35%；最新的5nm工艺首次贡献营收，占比达到了8%；16nm占比18%，与上个季度持平；10nm已经连续两个季度贡献为零；16nm以上的成熟制程占比下滑至39%。根据现有信息来看，台积电5nm营收的主要客户为苹果和华为。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"虽然美国的一系列芯片禁令可能会让台积电从华为等中国厂商获得的订单金额骤减，但苹果、高通、联发科、超微等已经陆续被媒体曝出向台积电大幅追加订单，甚至苹果今年下半年乃至未来一年的所有芯片订单基本被台积电垄断。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在今年中的股东大会上，台积电对芯片禁令的回应是："},{"type":"text","marks":[{"type":"strong"}],"text":"如果禁令得到实施，将会很快填补因美国最新禁令而造成的订单缺口（主要是无法出售给华为芯片），但很难预测有多快。"},{"type":"text","text":" "},{"type":"text","text":"现在看来，苹果、高通等公司的订单增加可以迅速让台积电填补空缺。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"最后，台积电在先进制程探索以及封装技术方面的工艺确实超过竞争对手太多，这也为台积电带来了更多的大客户订单。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"根据最新消息显示，台积电正在与谷歌等美国客户共同测试、开发一种先进的“整合芯片”封装技术，并计划于 2022 年量产。"},{"type":"text","text":"届时，谷歌及 AMD 将成为其第一批客户，"},{"type":"text","text":"谷歌"},{"type":"text","text":"计划将最新技术的芯片用于自动驾驶，而 AMD 则希望借此加大在与"},{"type":"text","text":"英特尔"},{"type":"text","text":"之间竞争胜出的概率。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"台积电将此 3D 封装技术命名为“SoIC（System on Integrated Chips）”，该方案可以实现将几种不同类型的芯片（例如处理器、内存或传感器）堆叠和链接到一个封装实体之中，因此得到的芯片尺寸更小，性能更强，能耗也更低。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"多名消息人士称，此技术将有助于半导体产业改变当前摩尔定律难以延续的现状。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"参考链接："}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"link","attrs":{"href":"https:\/\/www.infoq.cn\/article\/Lw6O4deaOh1yRuC2jsLX","title":"","type":null},"content":[{"type":"text","text":"https:\/\/www.infoq.cn\/article\/Lw6O4deaOh1yRuC2jsLX"}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"link","attrs":{"href":"https:\/\/www.reuters.com\/article\/us-tsmc-arizona\/phoenix-okays-development-deal-with-tsmc-for-12-billion-chip-factory-idUKKBN27Y30E","title":"","type":null},"content":[{"type":"text","text":"https:\/\/www.reuters.com\/article\/us-tsmc-arizona\/phoenix-okays-development-deal-with-tsmc-for-12-billion-chip-factory-idUKKBN27Y30E"}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}}]}