直插元件封裝焊盤各層面尺寸的選取:
1. BEGINLAYER
Regular Pad :根據器件的數據手冊提供的焊盤大小或者自測得的器件引腳尺寸來定。Thermal
Relief :通常比Regular Pad 大20mil 。Anti Pad :與Thermal Relief 設置一樣。
2. ENDLAYER
與BEGINLAYER 設置一樣。
3. DEFAULT INTERNAL
該層各個參數設置如下:
DRILL_SIZE >= 實際管腳尺寸+ 10MIL
50mil=1.27mm
40mil=1mm
(DRILL_SIZE<50) Regular Pad ≥ DRILL_SIZE + 16MIL(0.4mm)=實際管腳尺寸+26MIL=實際管腳尺寸+0.66mm
(DRILL_SIZE≥50) Regular Pad ≥DRILL_SIZE + 30MIL(0.76mm)=實際管腳尺寸+40MIL=實際管腳尺寸+1mm
(鑽孔爲矩形或橢圓形時) Regular Pad ≥ DRILL_SIZE + 40MIL(1mm)=實際管腳尺寸+50MIL=實際管腳尺寸+1.25mm
Thermal Pad = TRaXbXc-d 其中TRaXbXc-d 爲Flash 的名稱(後面有介紹)
見 https://blog.csdn.net/u014333269/article/details/80559224
Anti Pad = DRILL_SIZE + 30MIL=實際管腳尺寸+1mm
SOLDERMASK = Regular_Pad + 6MIL=實際管腳尺寸+0.4mm
總結:
管腳直徑<1mm:Regular Pad≥實際管腳尺寸+0.66mm
管腳直徑≥1mm:Regular Pad≥實際管腳尺寸+1mm
Anti Pad =實際管腳尺寸+1mm
SOLDERMASK = 實際管腳尺寸+0.4mm