OPPO发布首颗自研NPU芯片:历时3年研发,算力比肩苹果

{"type":"doc","content":[{"type":"blockquote","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"自研 NPU 芯片,可能只是一个开始。"}]}]},{"type":"heading","attrs":{"align":null,"level":2},"content":[{"type":"text","text":"OPPO 发布首颗自研 NPU 芯片"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在 12 月 14 日举行的 OPPO 未来科技大会 2021 上,OPPO 正式发布首颗自研 NPU 芯片马里亚纳 MariSilicon X。据 OPPO 创始人兼首席执行官陈明永介绍,该芯片经过 3 年研发,是由 OPPO 第一个自主设计、自主研发的影像专用 NPU 芯片。据悉,OPPO Find X 的下一代新品将首发搭载马里亚纳 X 芯片,并将在 2022 年第一季度发布,正式开启旗舰手机的通用平台+影像专用 NPU 的双芯时代。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.geekbang.org\/resource\/image\/d0\/b8\/d032bee521bdb64ce307cf01c2eb22b8.png","alt":null,"title":null,"style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":null,"fromPaste":true,"pastePass":true}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"据介绍,马里亚纳 X 采用了目前芯片行业相当先进的台积电 6nm 制程工艺,其 AI 计算单元 MariNeuro 完全由 OPPO 自研,采用 AI 芯片的新黄金架构——DSA 架构,实现了专芯专用,专注于解决用户关注的影像质量问题。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"算力方面,马里亚纳 X 的 AI 算力最高可达到 18TOPs,也就是每秒\/18 万亿次的 AI 计算。值得一提的是,苹果 iPhone 13 Pro Max上搭载的 A15 芯片算力为 15.8TOPs。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.geekbang.org\/resource\/image\/da\/4d\/daf0842180879331fec62f009643b64d.png","alt":null,"title":null,"style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":null,"fromPaste":true,"pastePass":true}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"马里亚纳 X 在 AI 计算单元集成了专用的片上内存子系统,只服务于 AI 计算,最高可提供每秒万亿比特的吞吐量,是目前手机最高内存吞吐量的十倍以上,打破了“内存墙”问题。此外,马里亚纳 X 还配备独立 DDR 带宽,最高可达到 8.5GB 每秒;并在 SoC 的基础上,增加了 17% 的系统总带宽。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"此外,马里亚纳 X 集成了由 OPPO 完全自研的 MariLumi 影像处理单元,支持 20bit 带宽;并支持 20bit 的 Ultra HDR 的超动态范围,是当前最先进通用平台能力的四倍。因此,其亮度比例,能够达到 100 万比 1。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"image","attrs":{"src":"https:\/\/static001.geekbang.org\/resource\/image\/fb\/a0\/fb077a180349e4fb66f797yye4a1cca0.png","alt":null,"title":null,"style":[{"key":"width","value":"75%"},{"key":"bordertype","value":"none"}],"href":null,"fromPaste":true,"pastePass":true}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"OPPO 芯片产品高级总监江波表示,马里亚纳 X 具有四大技术突破:空前强大的 AI 计算能效,行业领先的 Ultra HDR、无损的实时 RAW 计算、以及最大化传感器能力的RGBW Pro。这四大技术突破,共同构成了具有开创意义的影像专用 NPU,使得马里亚纳 X 能在满足领先的性能、完成视频 AI 实时处理的同时,还能兼顾出色的功耗控制、实现极致的能效比。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在芯片产业如此成熟的当下,OPPO 为何选择造芯?陈明永在会上表示,OPPO 造芯出于两点考虑:"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"bulletedlist","content":[{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"第一,造芯是基于用户的需要,用户对影像的需求在不断地升级。"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"第二,造芯是 OPPO 战略的必然选择,万物互联时代,科技公司必须通过关键技术解决关键问题,如果没有底层核心技术,就不可能有未来;而没有底层核心技术的旗舰产品,更是空中楼阁。"}]}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"OPPO 称,马里亚纳 X 是 OPPO 自研芯片的一小步,OPPO 未来会持续投入资源,用几千人的团队,去脚踏实地做自研芯片。"}]},{"type":"heading","attrs":{"align":null,"level":2},"content":[{"type":"text","text":"OPPO 造芯,早有计划"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"事实上,OPPO 造芯的决心早有迹象。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"在 2019 年 OPPO INNO DAY 上,陈明永就曾说“要有十年磨一剑”的信念,勇于迈入研发“深水区”,构建最为核心的底层硬件技术,并表示未来三年研发总投入将达到 500 亿元。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"据 36 氪此前报道, OPPO 对标芯片研发的马里亚纳计划早在 2019 年 11 月就已经出现在内部文件,项目由 2019 年 10 月成立的 OPPO 芯片 TMG(技术委员会)保证技术方面的投入,该委员会的负责人陈岩为芯片平台部的部长,此前担任 OPPO 研究院软件研究中心负责人,曾在高通担任技术总监。2020 年 1 月,Realme、一加的技术人员也加入到了芯片 TMG 的专家团。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"2020 年 2 月,OPPO 的马里亚纳计划进一步为人熟知。当时,OPPO CEO 特别助理发布内部文章《对打造核心技术的一些思考》,文中提出三大计划,涉及软件开发、云,以及硬件(芯片)。文章指出,马里亚纳计划意在表明做硬件最深的能力,而这个最深的能力毋庸讳言就是做芯片的能力,做顶级芯片的能力。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"“做芯片,我们实乃不得已而为之。不管是出于 OPPO 自身的差异化需求,出于用户对全场景科技体验的需求,还是出于手机‘软硬服’一体化的需求,即便是像高通、谷歌这么优秀的合作伙伴,都很难在现阶段支持我们的梦想。” OPPO 曾在内部文章中如此解释造芯的原因。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"2020 年 5 月,《日经亚洲评论》在一份报道中称,“OPPO 正在加紧设计自己的移动芯片,包括从联发科等供应商处争取顶尖工程人才。”该报道援引知情人士消息称,OPPO 已经从其主要芯片供应商联发科聘请了数名高管,以及从紫光展锐那聘请了多位工程师,目的是在上海建立一支经验丰富的芯片团队。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"据《时代财经》日前报道,第一手机研究院院长孙燕飙表示,OPPO 的芯片子公司泽库目前员工人数已经超过 2000 人,这意味着,泽库已经是“国内第二大芯片设计公司”,仅次于华为海思。"}]},{"type":"heading","attrs":{"align":null,"level":2},"content":[{"type":"text","text":"手机厂商齐聚自研芯片赛场"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"近年来,在芯片自主化的大背景下,越来越多的手机厂商开始走上自研芯片之路。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"“近几年,知名手机品牌在未来展望上都有评估自研芯片的可能性,希望透过自行研发的芯片,提供消费者更贴近品牌诉求的良好体验,并由此稳固消费者的品牌忠诚度,诸如三星手机、华为手机以及苹果手机等。” 集邦咨询分析师黄郁琁曾"},{"type":"link","attrs":{"href":"https:\/\/www.infoq.cn\/article\/OATFZfcaq1cETtlh3HDD","title":"xxx","type":null},"content":[{"type":"text","text":"向 InfoQ 表示"}]},{"type":"text","text":",自 2019 年年中开始,受中美贸易摩擦的影响,各手机厂商都在加速这一梦想蓝图的实现。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"国内方面,除刚发布自研芯片的 OPPO,华为、小米、vivo 都已在"},{"type":"link","attrs":{"href":"https:\/\/www.infoq.cn\/article\/wjmYeU0bfwIxTSJTav0j","title":"xxx","type":null},"content":[{"type":"text","text":"自研芯片赛道"}]},{"type":"text","text":"发力。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"其中,华为的海思麒麟芯片最为受到关注。华为旗下芯片部门海思是中国最大的芯片设计企业,其手机所需芯片基本能实现自给自足。近几年,受美国制裁影响,华为的麒麟高端芯片在生产上遭受打击。去年,余承东曾表示,由于美国制裁,华为的麒麟高端芯片在 2020 年 9 月 15 日之后无法制造,将成为绝唱。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"小米的首款自研芯片澎湃 C1 亮相于今年 3 月份。据悉,该芯片是小米首款专业影像芯片,目前已经应用在小米 MIX FOLD 上,预计后面还会有更多手机用上这款芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"vivo 的首款自研芯片 V1 亮相于今年 9 月份。据悉,该芯片是由 vivo主导开发的,服务高速计算成像的专业影像芯片,是一颗全定制的特殊规格集成电路芯片。这款 V1 芯片将在 vivo X70 系列首发搭载。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"而在国外,也有包括苹果、谷歌在内的多家公司聚焦在自研芯片赛道上。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"从 2010 年亮相的 iPhone 4 搭载的 A4 芯片,到去年专为 Mac 打造的 M1 芯片,苹果在自研芯片道路上走得较为长远,性能实力也确实强劲。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"今年 10 月,谷歌也推出了首款自研芯片 Tensor。谷歌最新推出的 Pixel6 和 Pixel6Pro 手机,搭载的正是 Tensor 芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"不过值得一提的是,苹果、谷歌、华为自研的都是 SoC 芯片;小米(澎湃 C1)、vivo(V1)当前自研的是 ISP 芯片;OPPO(马里亚纳 X)自研的则是 NPU 芯片。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"据了解,SoC 芯片需要更长时间、高强度的资金和技术投入,而 ISP、NPU 芯片的技术难度和投入资金相对会低一些。据腾讯新闻《潜望》报道,vivo 执行副总裁、首席运营官胡柏山在接受采访时表示,“SoC 芯片投入大,行业内已有高通、MTK 等投入重资源在做。影像这一块,每个品牌都有自己的方向,而不同的方向需要不同的算法来支撑。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"知乎答主"},{"type":"link","attrs":{"href":"https:\/\/www.zhihu.com\/question\/504463939","title":"xxx","type":null},"content":[{"type":"text","text":"庄明浩"}]},{"type":"text","text":"在分析 OPPO 为何造 NPU 芯片时表示,NPU-AI 芯片是竞争热点,中国厂商的弯道超车机会可能来自于 NPU:"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"“每一代 CPU 和 GPU 性能提升在放缓,而与之相对应的是 AI 芯片成为新的竞争热点……相较于此前的 CPU\\GPU 领域,中国厂商在 NPU 领域与海外公司起点并没有差太远,这和中国 AI 厂商在过去今年的技术\\算法的发展以及商业落地有关,也与中国有更大的数据量级和应用场景更加相关……提及场景,中国庞大的应用场景和市场也是这一波 NPU 在国内发展迅速的核心原动力之一,而基于场景的生态构建也是NPU能够被大量使用的重要前提……考虑到 OPPO 手机一直以来都主打的影像功能,大概率此次 NPU 主要应用场景应该是影像相关。”"}]}]}
發表評論
所有評論
還沒有人評論,想成為第一個評論的人麼? 請在上方評論欄輸入並且點擊發布.
相關文章