IBM造出首颗2nm芯片，GAA终于接棒FinFET

原創

2021-05-09 12:13

{"type":"doc","content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"IBM 站到世界的最前沿，芯片产业迎来又一个里程碑，摩尔定律再次被拯救，这就是2021年5月6日，全球芯片产业界所发生的事。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"当日，IBM 于"},{"type":"link","attrs":{"href":"https:\/\/newsroom.ibm.com\/2021-05-06-IBM-Unveils-Worlds-First-2-Nanometer-Chip-Technology,-Opening-a-New-Frontier-for-Semiconductors","title":null,"type":null},"content":[{"type":"text","text":"官网"}],"marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"宣布推出全球首创的2纳米芯片技术，“为半导体产业开辟了新的领域”。当下，业内只有台积电、三星实现了 3nm 制程芯片的研发，且尚未实现量产，2nm 芯片确为业界首创。根据外媒披露的情况来看，IBM 2nm 芯片的晶体管密度可以达到每平方毫米3.33亿个(MTr\/mm2)。同时，从 IBM 官网披露的图片来看，该2nm芯片采用了GAA（Gate-All-Around，环绕栅极晶体管）工艺，也为该项工艺后续的普及打下了坚实的基础。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"embedcomp","attrs":{"type":"table","data":{"content":"

最高晶体管密度 (MTr\/mm2)
AnandTech	IBM	台积电	英特尔	三星
22纳米			16.50
16纳米\/14纳米		28.88	44.67	33.32
10纳米		52.51	100.76	51.82
7纳米		91.20	237.18*	95.08
5纳米		171.30
3纳米		292.21*
2纳米	333.33
数据来自Wikichip，不同代工厂商可能采用不同的计数方法 * 表中所列，为逻辑密度"}}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":"center","origin":null},"content":[{"type":"text","marks":[{"type":"size","attrs":{"size":9}},{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"由外媒整理的晶体管密度对比参考"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":"center","origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"heading","attrs":{"align":null,"level":4},"content":[{"type":"text","text":"从3nm到2nm，GAA才是这一事件的核心"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"2nm芯片研制成功，意味着各项指标都会出现大幅提升。IBM 对外表示：“"},{"type":"text","marks":[{"type":"color","attrs":{"color":"#323232","name":"user"}}],"text":"与当今最先进的7 nm节点芯片相比，预计它将实现45％的性能提高或75％的能耗降低。”公告同时贴出了更加具体的潜在性能优势对比："}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"bulletedlist","content":[{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"手机电池寿命增加三倍，仅要求用户每四天为设备充电一次。"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"削减数据中心的碳足迹（"},{"type":"text","marks":[{"type":"color","attrs":{"color":"#4d5156","name":"user"}}],"text":"指由个人、事件、组织、服务或产品造成的温室气体总排放量"},{"type":"text","text":"），这些数据中心占全球能源使用量的百分之一；"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"更快地处理应用程序，更快地访问互联网，极大增强笔记本电脑的功能。"}]}]},{"type":"listitem","attrs":{"listStyle":null},"content":[{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"有助于自动驾驶汽车加快物体检测速度，降低反应时间。"}]}]}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"实际上，在芯片设计阶段，最重要的指标就是“"},{"type":"link","attrs":{"href":"https:\/\/www.zhihu.com\/zvideo\/1342452241006153728","title":"xxx","type":null},"content":[{"type":"text","text":"PPA"}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"”，即Power（功耗）、Performance（性能）、Area（面积），但三者很难兼备，实际产品往往与宣传效果相去甚远。“服务器\/FPGA一般更重视性能，手机芯片一般重视价格和功耗”，前ARM公司基础设施事业线高级产品经理、某大厂前高级产品经理邵巍博士简明地总结道。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"但即便如此，以上性能提升和能耗降低指标，对于整个半导体行业而言，仍然是非常重要的创新和飞跃。问题是，这在短时间内仍然无法实现。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"首先，研制成功不等于量产成功。前ARM公司基础设施事业线高级产品经理、某大厂前高级产品经理邵巍博士表示：“在IBM（发布）的新闻中，没有提到良率问题，因此整个业界什么时候能够真正用上2nm的制程，还需要等待量产的消息。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"此外，“新闻中也漏掉了常见的客户背书环节，因此推测一下，暂时还无客户。在无客户的情况下，很难推测从研制到量产需要多久”，邵巍博士补充道。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"况且，2nm 芯片因工艺特殊，对光刻机的要求也更为苛刻。有消息称，荷兰 ASML 公司的全新一代光刻机预计到 2025 年量产，其 NA值提升到 0.5 ，很可能足以支撑 2nm 支撑芯片的量产。如果消息属实，意味着，到2025年产业界才具备 2nm 芯片的基础量产条件。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"相比之下，该芯片对 GAA 工艺的应用实践，反而更具意义。什么是 GAA 呢？Nerissa Draeger博士在此前的一篇采访中形容的较为简洁易懂：“"},{"type":"link","attrs":{"href":"https:\/\/www.bilibili.com\/read\/cv8275344","title":"xxx","type":null},"content":[{"type":"text","text":"环绕栅极晶体管 (GAA) "}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"是一种经过改良的晶体管结构，其中通道的所有面都与栅极接触，这样就可以实现连续缩放。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"与GAA相对应的是"},{"type":"link","attrs":{"href":"https:\/\/baike.baidu.com\/item\/%E9%B3%8D%E5%BC%8F%E5%9C%BA%E6%95%88%E5%BA%94%E6%99%B6%E4%BD%93%E7%AE%A1\/23200647?fromtitle=FinFET&fromid=5883551&fr=aladdin","title":"xxx","type":null},"content":[{"type":"text","text":"FinFET（鳍式场效应晶体管）"}]},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"，FinFET是芯片从22nm逐步进军7nm、5nm的关键工艺，其发明人胡正明教授因此被称作“挽救了摩尔定律的男人”。可在进入 7nm 以下后，FinFET逼近极限，产业界迫切需要新的工艺技术。这时，GAA 出现了。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"三星对 GAA 极为推崇，但“老大哥”台积电则求稳不求快。去年 8 月，台积电对外表示，公司的 3nm 将继续沿用之前的 FinFET，这也为GAA的落地、普及蒙上了一层阴影。此次 IBM 2nm GAA 芯片的问世，等于彻底打通了从3nm到2nm的路径。此前，人们还在犹豫：GAA能否替代FinFET？如今，这样的疑问随着 2nm 芯片的问世烟消云散。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"“这是一个大进步，对于整个半导体业界来说，算是对GAA技术的双保险，至少工艺制程演进到3nm\/2nm不存在太多障碍了，可喜可贺。”邵巍博士在采访中高兴地说道。"}]},{"type":"heading","attrs":{"align":null,"level":4},"content":[{"type":"text","text":"台积电、三星、英特尔的三强之争"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"IBM 本身并不具备量产芯片的条件和能力，其 2nm 芯片会通过授权的形式，交给高端芯片代工厂商来完成。这本来不是什么了不得的事，仅仅是产业链分工细化的表现。但对于台积电而言，事情就没那么简单了。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"台积电（TSMC）创始人张忠谋在“2021大师智库论坛”曾表示，台积电最大的竞争对手仍然是三星。而双方也确实在 3nm 芯片这一阵地剑拔弩张。据媒体报道，三星曾对外宣布未来10年投资超1000亿美元，目标到2025年在芯片制造领域内保持领先。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"不过现实往往不遂人愿，虽然三星自称在2002年就对GAA保持关注并投入研究，但其3nm GAA 芯片的量产至今仍无确切时间。反观台积电，3nm FinFET 芯片预计 2022 就可以实现量产，2nm GAA芯片也在研制中。看样子，台积电还将稳坐全球芯片代工第一的宝座。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"但此时与三星保持良好合作关系的 IBM ，突然宣布 2nm GAA 芯片研制成功，将局势逆转，对台积电的既定规划造成了冲击。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"除了三星，英特尔也很可能参与到代工生产中来，况且英特尔入局代工生意本就属于“突袭”，此前英特尔新任 CEO 帕特・基辛格更是宣称 2 年内超越台积电。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"竞争更加激烈，局势更加复杂，这就是台积电面对的未来市场。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"好在台积电的真正命脉在于苹果、高通的大笔订单。只要做好小步快跑，短期内并不会因为 IBM 2nm 芯片的出现收到较大冲击。“大家（代工厂商与客户）一般都会提前对齐3-5年的目标，苹果不会介意 2nm\/3nm这种名字，对齐的都是跟细节的参数”，邵巍博士对InfoQ记者说道，“苹果那个产能需求量，谁接了单，都得加工厂、加生产线，至少提前2年。”"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":" "}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"对于台积电而言，真正的战役可能不在当下，而是在未来的 3 - 5 年内，与“挑战者”三星来一场针尖对麦芒的比拼。"}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null}},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","marks":[{"type":"strong"}],"text":"嘉宾介绍："}]},{"type":"paragraph","attrs":{"indent":0,"number":0,"align":null,"origin":null},"content":[{"type":"text","text":"邵巍，"},{"type":"text","marks":[{"type":"color","attrs":{"color":"#494949","name":"user"}}],"text":"前ARM公司基础设施事业线高级产品经理，某大厂前高级产品经理"},{"type":"text","text":"。"}]}]}